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  3. 3D BGA Reballing Stencil Kit for iPhone X, Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
OEM
BGA Reballing

3D BGA Reballing Stencil Kit for iPhone X, Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

#53080

3D BGA Reballing Stencil Kit for iPhone X, Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

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    • Packing Type: Bulk
    • Warranty: 360 days
    • Product Quality: OEM
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    Adopting high-speed numerical control technology and high-temperature resistant toughened materials production, round square precise hole posttion, make steel net more durable, easier to take off the net, more efficient.

    -It's easy to scrape tin, high steel plate thickness, high strength, not easy to deform when pressed by hand.

    -Positioning slot is made of high temperature resistant synthetic stone.

    -Small and portable, it can be magnified under a microscope.

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