1. Silicone anti-slip pads and cooling holes: hollow grids and non-slip silicone pads are used on the bottom to effectively insulate the temperature, anti-slip and efficient heat dissipation.
2. High hardness thick synthetic stone: The main body is made of special synthetic stone material, high temperature resistance, strong and durable.
3. High Purity Copper Film - Ensures even and stable heat transfer and heating and accurate card positioning.
4. Remove the glue from the CPU and other components: support a variety of chips / universal hard disk / fingerprint cable / CPU degumming and tin removal, accurate card position, non-destructive repair.
Ambalaj | Blister |
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